Synergie CAD Capabilities
Core Business
- Multi layer controlled impedance boards
- Complete component assembly and test
- Quantities 1 to 1.000 boards
- Total solution provider
Technology
- Micro BGA boards down to 0.3mm pitch
- Frequency: 10 GHz RF
- Temperature: -50C up to 250C
- Extensive Mixed Signal/RF Experience
- Wafer Probe, Package Test and Burn-in
Design
- Seven Engineering and Design Centers
- Continuous 24-hour Design capability through USA, Europe and Asia
- All Designs thoroughly checked with CAM tools before committing to fabrication
Board Fabrication
- All boards fabricated by specialized in-house PCB facility
- Processes tailored for test board needs
- CIC technology used for improved flatness, strength and temperature
performance
- Up to 40 multi-layers
- Thickness : Up to 6.5mm
- Maximum Board Size : 750mm x 580mm
- Improved Planarity through CIC Technology
- Dry Film Exposure - Clean Room rated 1.000
- Laser Direct Imaging
- Blind and buried via
- Laser Drilling
- Minimum hole diameter 0.075mm
- Impedance Control
Assembly
- Boards assembled in Synergie-Cad custom shop located inside PCB facility
- Loaded boards tested for functionality as defined in schematic/CAD
- Automated assembly for high component count and volume production requirements
- Assembly Department more than 60 employees
- Component sourcing
- 18.000+ components per board with complete testing
- Dedicated CAM department for assembly data preparation
- Complete Loaded and Tested Board Solution
